Japan Shin-Etsu Silicone RTV Heat Dissipating Material
Differences in heat dissipation materials
Thermal conductivity: thermal grease > phase transition material > heat sink
Handling: Phase change materials, heat sinks > Thermal grease
Cost: Thermal grease < Phase change material, heat sink
Irregular plane heat dissipation:
Thermally conductive clay (small area)
Potting (large area)
Shin-Etsu Commonly Used Heat Dissipating Materials
Silicone grease:
Low level: KS-609, G-746, G-747
Advanced: X-23-7762, X-23-7783D
Heat sink:
High hardness TC-20A, TC-20CG
Low hardness TC-CAD, TC-CAT, TC-CAS, TC
CAB
Double-sided adhesive tape: TC-10SAS.TC-20SAS
- PREV：Japan Shin-Etsu Silicone Thermal Conductive Material Non-curing Thermal Grease G 775, G 777, G 779
- NEXT：Japan Shin-Etsu Silicone RTV Coating Material
