Japan Shin-Etsu Organosilicon Oligomer R Type - 广州昊毅新材料科技股份有限公司

Silicone oligomer

Japan Shin-Etsu Organosilicon Oligomer R Type

                                                            

 

 Silicone oligomer

Silicone oligomer is a relatively low molecular weight silicone resin. Due to its structural characteristics, it plays a great role as a resin monomer, as a modifier of organic resins, and as an interface modifier. is a very unique product.

(1) As a resin monomer

Main features: water resistance, weather resistance, high hardness

Applications: Body Coatings, Floor Coatings, Hydrophobicity

(2) As an organic resin modifier

Main features: adhesion, weather resistance, water resistance

Applications: substrates, sealing materials, adhesives, adhesives, coatings for building materials

 

R type product

As a reactive functional group, this is an organosilicon oligomer that has only an epoxy group and can be cationically cured with acid anhydride, light and heat. It has the same curing mechanism as epoxy resins, but has the heat resistance and high Tg possessed by siloxanes. In addition, types with a cyclic siloxane backbone are characterized by less shrinkage upon curing

 

Features 

① is a silicone containing reactive functional groups

②Because it is a relatively low molecular weight, it has excellent compatibility with various materials

③By adding an acid generator, it can be cured by light or heat

④ Heat curing by adding acid anhydride, amine catalyst, etc.

⑤KR-470, excellent in curability, hardness and strength after curing

⑥KR-470, almost no shrinkage during curing
 

General characteristics

 

KR-470

X-40-2678

Number of epoxy functional groups

4

2

Viscosity 25°C mPa.s

3000

120

Epoxy equivalent g/mol

200

290

 

Comparison of cured physical properties

 

KR-470

epoxy

Cycloaliphatic epoxy resin

curing method

Anhydride curing

Hardness Shore D

87

85

88

Flexural modulus MPa

2590

2940

3020

Curing shrinkage Gravity method %

+2.1

-1.7

-5.3

Boiling water absorption rate %

0.46

0.28

0.56

Tg °C

191

150

193

Linear expansion coefficient

(X10^-5/K)

<Tg

9.7

7.7

6.9

>Tg

15.4

17.6

16.2

 

 

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