Japan Shin-Etsu Silicone RTV Heat Dissipating Material
Details

Differences in heat dissipation materials 

 Thermal conductivity: thermal grease > phase transition material > heat sink

 Handling: Phase change materials, heat sinks > Thermal grease

 Cost: Thermal grease < Phase change material, heat sink

 Irregular plane heat dissipation:

Thermally conductive clay (small area)

Potting (large area)

 

  Shin-Etsu Commonly Used Heat Dissipating Materials

 Silicone grease:

Low level: KS-609, G-746, G-747

Advanced: X-23-7762, X-23-7783D

 Heat sink:

High hardness TC-20A, TC-20CG

Low hardness TC-CAD, TC-CAT, TC-CAS, TC

CAB

Double-sided adhesive tape: TC-10SAS.TC-20SAS