Japan Shin-Etsu Silicone Thermal Conductive Material Thermally Conductive Adhesive Material Condensation Reaction Type (One-component) KE-4961-W, KEN-
Details

  Thermally conductive adhesives Condensation reaction type (one-component type)

 

 

KE-3467

KE-4961-W

KE-4962-W

KEN-4988-W

curing type

 

Condensation (deacetone)

Condensation (Dealcoholization)

Condensation (Dealcoholization)

Condensation (Dealcoholization)

Exterior

 

White

White

White

White

Viscosity

Pa-s

100

Paste

Paste

Paste

Dry time

min

4

1

1

2

Physical properties after curing

Density (23℃)

 

2.9

2.34

2.65

1.61

hardness

TypeA

91

80

88

76

stretch length

%

30

60

30

70

tensile strength

MPa

3.6

4.4

4.4

4.0

bond strength

Al/Al

MPa

0.5

0.7

0.8

1.0

Thermal conductivity

W/m-k

2.4

1.6

2.4

0.75

Flame retardant : UL94

 

V-0

V-0

V-0 quite

V-0 equivalent (3mm)

 

Features

The glue before curing has various types of viscosity such as medium viscosity to paste, suitable for bonding heating parts

Adoption example

Fixing of substrate parts, etc.